Department of Electrical and Electronics EngineeringDepartment of Mechanical Engineering2024-11-102006978-1-4244-0139-02474-374710.1109/NEMS.2006.3346402-s2.0-46149085642http://dx.doi.org/10.1109/NEMS.2006.334640https://hdl.handle.net/20.500.14288/16749Lack of batch-compatible fabrication techniques can be considered as the most important challenge in the integration of nanostructures with microelectromechanical systems (MEMS). a solution to the micro-nano integration problem is offered by introducing a batch-compatible nanowire fabrication technique based on basic lithographic techniques and guided self-assembly. the basic principle is obtaining cracks at predetermined locations in a sacrificial SiO2 layer on Si and filling these cracks with a suitable metal by electrodeposition. the technique is demonstrated by using Nickel-Iron as the deposition material and verifying the magnetic behavior of resulting nanowires.Electrical electronics engineeringNanoscienceNanotechnologyConference proceeding2474-3755248485802017N/A7235