Department of Electrical and Electronics Engineering2024-11-092006081946112197808194611240277-786X10.1117/12.6647772-s2.0-33746687003https://hdl.handle.net/20.500.14288/626A 2D MEMS platform for a microlens scanner application is reported. The platform is fabricated on an SOI wafer with 50/μm thick device layer. Entire device is defined with a single etching step on the same layer. Through four S-shaped beams, the device is capable of producing nonlinear 2D motion from linear ID translation of two pairs of comb actuator sets. The device has a clear aperture of 2mm by 2mm, which is hallowed from the backside for micro-optics assembly. In this paper, a numerical device model and its validation via experimental characterization results are presented. Integration of the micro-optical components with the stage is also discussed. Additionally, a new driving scheme to minimize the settling time of the device in DC operation is explored.pdfEngineeringElectrical and electronicConference proceedinghttps://doi.org/10.1117/12.664777N/ANOIR01002