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Department: search.filters.department.Department of PhysicsSubject: search.filters.subject.Industrial engineering

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    Analysis of thermal fields in orthogonal machining with infrared imaging
    (Elsevier Science Sa, 2008) Department of Mechanical Engineering; Department of Mechanical Engineering; Department of Physics; Lazoğlu, İsmail; Serpengüzel, Ali; N/A; Faculty Member; Faculty Member; Department of Mechanical Engineering; Department of Physics; Manufacturing and Automation Research Center (MARC); Manufacturing and Automation Research Center (MARC); N/A; College of Engineering; College of Engineering; College of Sciences; N/A; 179391; 27855
    The validation of a previously developed finite difference temperature prediction model is carried out for orthogonal machining process with a high precision infrared camera set-up, considering the temperature distribution in the tool. the thermal experiments are conducted with two different materials; al 7075, AISI 1050, with two different tool geometries; inserts having a rake angle of 6 degrees and 18 degrees, for different cutting velocities and feedrates. an infrared camera set-up is utilized for the thermal experiments. the results of the high precision infrared thermal measurements are compared with the outputs of the finite difference temperature model, considering the maximum and the mean temperatures in the tool-chip interface zone and the temperature distributions on the tool take face. the maximum tool-chip interface temperature increases with increasing cutting velocity and feedrate. the relationship between the maximum tool-chip interface temperature and the rake angle of the tool is not distinctive. the experimental results show good agreement with the simulations. (c) 2007 Elsevier B.V. all rights reserved.