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    PublicationOpen Access
    Simulation of bulk piezoelectric implant with amplitude modulation-based backscatter communication for implant applications
    (Institute of Electrical and Electronics Engineers (IEEE), 2021) Akhtar M.J., Toymus A.T., Beker L.; Department of Mechanical Engineering; Department of Electrical and Electronics Engineering; Toymus, Alp Timuçin; Akhtar, Muhammad Junaid; Beker, Levent; Faculty Member; Department of Mechanical Engineering; Department of Electrical and Electronics Engineering; College of Engineering; Graduate School of Sciences and Engineering; N/A; N/A; 308798
    Recently, ultrasound has been used for power transfer and backward data transmission from implantable medical devices. Backward data communication is typically based on the amplitude modulation of the backscattered signal with changing electrical load of the implant. Contrary to its importance, the sensitivity of the backscattered voltage with reference to the electrical load has not been quantitatively determined yet. This work presents the results of transient simulations and shows the increasing trend in echo voltage with the increasing load resistance. Additionally, simulation studies indicate a decreasing sensitivity of echo voltage to load resistance with increasing backing impedance of the implant.