Researcher:
Motlagh, Peyman Lahe

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PhD Student

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Peyman Lahe

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Motlagh

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Motlagh, Peyman Lahe

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2018 - 201922020 - 20212

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    A spectral Tchebychev solution for electromechanical analysis of thin curved panels with multiple integrated piezo-patches
    (Elsevier, 2020) Bediz, Bekir; N/A; Department of Mechanical Engineering; Motlagh, Peyman Lahe; Başdoğan, İpek; PhD Student; Faculty Member; Department of Mechanical Engineering; Graduate School of Sciences and Engineering; College of Engineering; 355153; 179940
    This paper presents an electromechanical model for predicting the dynamics of curved panels with multiple surface-integrated piezo-patches. The boundary value problem governing the electro-elastic dynamic behavior of a (doubly-) curved panel and piezo-patch structure is derived following the first order shear deformation (FSDT) theory. Spectral Tchebychev approach is used to numerically solve the system dynamics and obtain voltage and mechanical frequency response functions (FRFs). Mass and stiffness contributions of piezo-patch(es) as well as two-way electromechanical coupling behavior are incorporated in the model for both modal analysis and frequency response calculations. To validate the accuracy of the developed solution technique, the results for various cases including a single patch and multiple patches on a straight/curved host panel are compared to those obtained from finite-element (FE) analyses. It is shown that the maximum difference in the predicted natural frequencies between the ST and FE results is below 1%, and the harmonic analyses' results obtained using the presented solution technique excellently match the FE results. Furthermore, the effect of multiple piezoelectric patches to achieve higher voltage values in the application of energy harvesting is investigated when the mode jumping phenomenon occurs due to the increasing curvature.
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    A general electromechanical model for plates with integrated piezo-patches using spectral-Tchebychev method
    (Elsevier, 2019) Bediz, Bekir; Department of Mechanical Engineering; N/A; Department of Mechanical Engineering; Aghakhani, Amirreza; Motlagh, Peyman Lahe; Başdoğan, İpek; PhD Student; PhD Student; Faculty Member; Department of Mechanical Engineering; Graduate School of Sciences and Engineering; Graduate School of Sciences and Engineering; College of Engineering; N/A; 355153; 179940
    This paper presents a general electromechanical model for predicting the dynamics of thin or moderately thick plates with surface-integrated piezo-patches. Using spectral Tchebychev (ST) technique, the boundary value problem governing the electroelastic dynamics of the two dimensional (2D) plate and piezo-patch structure is developed with Mindlin plate theory assumptions. Mass and stiffness contributions of piezo-patch(es) as well as two-way electromechanical coupling behavior are incorporated in the model for both modal analysis and frequency response calculations. To validate the accuracy of the developed solution technique, the modal analysis results are compared against the existing Rayleigh-Ritz solution from the literature as well as the finite-element simulation results for various piezo-patch sizes on thin and moderately thick host plates; and it is shown that the maximum difference in the predicted natural frequencies between the ST and FE results are below 1%. The electromechanical frequency response functions (FRFs) including the vibration response and electrical output of the system under a transverse point force excitation are obtained using the ST model and the results are shown to match perfectly with the finite element (FE) simulations. Additionally, comparisons of the electromechanical FRFs calculated based on Rayleigh-Ritz method from the literature versus the developed framework is presented to highlight that the exclusion of shear deformation terms in the former model leads to an inaccurate estimation of electroelastic behavior for the case of thicker plates with integrated piezo-patches. Finally, the investigated case studies demonstrate that the computational efficiency of the developed method is significantly higher than that of FE simulations. (C) 2019 Elsevier Ltd. All rights reserved.
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    Electromechanical analysis of functionally graded panels with surface-integrated piezo-patches for optimal energy harvesting
    (Elsevier Sci Ltd, 2021) Anamagh, Mirmeysam Rafiei; Bediz, Bekir; N/A; Department of Mechanical Engineering; Motlagh, Peyman Lahe; Başdoğan, İpek; PhD Student; Faculty Member; Department of Mechanical Engineering; Graduate School of Sciences and Engineering; College of Engineering; 355153; 179940
    This paper presents an electromechanical modeling approach for predicting the dynamics of (straight/curved) functionally graded panels with multiple surface-integrated piezo-patches. Bi-axial material variation is considered using the theory of mixture approach. The governing equations are derived following the first order shear deformation theory and the Hamilton?s principle. The derived boundary value problem is solved numerically using a meshless approach based on Chebyshev polynomials. Mass and stiffness contributions of piezo-patch (es), as well as two-way electromechanical coupling behavior, are incorporated both for modal and harmonic analyses. To validate the accuracy of the presented solution technique, the results for various cases are compared to those obtained from finite-element analyses. It is shown that the maximum difference in the predicted natural frequencies is below 1%, but for a fraction of the computational time. Furthermore, the harmonic analysis results excellently match FE results. Note that material variation changes the spatial stiffness of the panel and thus, the functionally graded panel can be designed according to a predefined objective function using the proposed modeling approach. As a demonstration, specific to energy harvesting application, the voltage/power output was maximized through material and geometry/shape variations. It was demonstrated that significant improvements can be achieved through the presented methodology.
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    Passive vibration control of a plate via piezoelectric shunt damping with FEM and ECM
    (Society of Photo-optical Instrumentation Engineers (SPIE), 2018) Department of Mechanical Engineering; Aghakhani, Amirreza; Başdoğan, İpek; Motlagh, Peyman Lahe; PhD Student; Department of Mechanical Engineering; College of Engineering; N/A; 179940; N/A
    Two-dimensional thin plates are widely used in many aerospace, automotive and marine applications. Vibration attenuation can be achieved in these structures by attaching piezoelectric elements on to the structure integrated with shunt damping circuits. This enables a compact vibration damping method without adding significant mass and volumetric occupancy, unlike the bulky mechanical dampers. Practical implementation of shunt damping technique requires accurate modeling of the host structure, the piezoelectric elements and the dynamics of the shunt circuit. Unlike other studies in the literature of piezoelectric shunt damping, this work utilizes a multi-modal equivalent circuit model (ECM) of a thin plate with multiple piezo-patches, to demonstrate the performance of shunt circuits. The equivalent system parameters are obtained from the modal analysis solution based on the Rayleigh-Ritz method. The ECM is coupled to the shunt circuits in SPICE software, where the shunt configuration consists of three branches of electrical resonators, each tuned to one vibration mode of the structure. Using the harmonic analysis in SPICE for a range of excitation frequencies, current output of each ECM branch is calculated for open-circuit and optimum shunt circuit conditions. The current of ECM branches are then converted to the displacement outputs in physical coordinates and validated by the finite-element simulations in ANSYS. It is shown that the vibration attenuation of a vibration mode can be successfully achieved when there is a reduction in the corresponding current amplitude of the ECM branch. This correlation can be utilized in the design of efficient linear/nonlinear shunt circuits.