Researcher:
Erarslan, Refik Burak

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Refik Burak

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Erarslan

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Erarslan, Refik Burak

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2012 - 20144

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Researcher Of Publications: search.filters.isAuthorOfPublication.b9417fef-86c4-45de-9ec4-94881e79bad1

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    Design and characterization of micromachined sensor array integrated with CMOS based optical readout
    (Elsevier Science Sa, 2014) Temiz, Yüksel; Leblebici, Yusuf; Torun, Hamdi; N/A; N/A; N/A; Department of Electrical and Electronics Engineering; Department of Electrical and Electronics Engineering; Erarslan, Refik Burak; Adiyan, Ulaş; Lüleç, Sevil Zeynep; Ölçer, Selim; Ürey, Hakan; Other; PhD Student; Master Student; Other; Faculty Member; Department of Electrical and Electronics Engineering; N/A; Graduate School of Sciences and Engineering; Graduate School of Sciences and Engineering; College of Engineering; College of Engineering; N/A; N/A; N/A; N/A; 8579
    This paper reports a micro electro-mechanical system (MEMS) based sensor array integrated with CMOSbased optical readout. The integrated architecture has several unique features. MEMS devices are passive and there are no electrical connections to the MEMS sensor array. Thus, the architecture is scalable to large array formats for parallel measurement applications and can even be made as a disposable cartridge in the future using self-aligning features. A CMOS-based readout integrated circuit (ROIC) is integrated to the MEMS chip. Via holes are defined on ROIC by customized post-processing and MEMS chip is thinned down by a grinding process to enable integrated optical readout. A diffraction grating interferometerbased optical readout is realized by pixel-level illumination of the MEMS chip through the via holes and by capturing the reflected light using a photodetector array on the CMOS chip. A model for the optical readout principle has been developed using Fourier optics. (C) 2013 Elsevier B.V. All rights reserved.
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    MEMS sensor array platform integrated with CMOS based optical readout
    (Institute of Electrical and Electronics Engineers (IEEE), 2013) Temiz, Yuksel; Leblebici, Yusuf; Torun, Hamdi; N/A; N/A; N/A; Department of Electrical and Electronics Engineering; Department of Electrical and Electronics Engineering; Erarslan, Refik Burak; Lüleç, Sevil Zeynep; Adiyan, Ulaş; Ölçer, Selim; Ürey, Hakan; Other; Master Srudent; PhD Student; Other; Faculty Member; Department of Electrical and Electronics Engineering; N/A; Graduate School of Sciences and Engineering; Graduate School of Sciences and Engineering; College of Engineering; College of Engineering; N/A; N/A; N/A; N/A; 8579
    This paper reports a micro electro-mechanical system (MEMS) based sensor array integrated with CMOS-based optical readout. The integrated architecture has several unique features and reported here for the first time. MEMS devices are passive and there are no electrical connections to the MEMS sensor array. Thus the architecture is scalable to large array formats for parallel measurement applications and can even be made as a disposable cartridge in the future using self-aligning features. A CMOS-based readout integrated circuit (ROIC) is integrated to the MEMS chip. Via holes are defined on ROIC by customized post-processing to enable integrated optical readout. A diffraction grating interferometer-based optical readout is realized by pixel-level illumination of the MEMS chip through the via holes and by capturing the reflected light using a photodetector array on the CMOS chip.
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    Simultaneous two-wavelength readout for thermo-mechanical MEMS detectors
    (IEEE, 2014) Ferhanoğlu, Onur; Torun, Hamdi; N/A; N/A; N/A; Department of Electrical and Electronics Engineering; Adiyan, Ulaş; Çivitçi, Fehmi; Erarslan, Refik Burak; Ürey, Hakan; PhD Student; Researcher; Other; Faculty Member; Department of Electrical and Electronics Engineering; Graduate School of Sciences and Engineering; N/A; N/A; College of Engineering; N/A; 194282; N/A; 8579
    We proposed a novel two-wavelength optical readout for grating based thenno-mechanical MEMS arrays by using two color LEDS butt-coupled to a multi-mode fiber, which provides spatial auto-registration of two different color images on a single camera. The -1st diffraction orders of the different colors are simultaneously monitored with different channels (R and G) of the RGB camera. The sensitivity of the MEMS array is improved by using the channel data with higher sensitivity for each MEMS detector under a thermal load.
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    PublicationOpen Access
    Diffraction grating based optical readout for thermal imaging
    (Society of Photo-optical Instrumentation Engineers (SPIE), 2012) Department of Electrical and Electronics Engineering; Adiyan, Ulaş; Erarslan, Refik Burak; Torun, Hamdi; Ferhanoğlu, Onur; Ürey, Hakan; PhD Student; Faculty Member; Department of Electrical and Electronics Engineering; College of Engineering; N/A; N/A; N/A; N/A; 8579
    The thermal sensor system presented in this paper is based on the mechanical bending due to the incident IR radiation. A diffraction grating is embedded under each pixel to facilitate optical readout. Typically the first diffraction order is used to monitor the sub-micron mechanical displacement with sub-nanometer precision. In this work; two different optical readout systems based on diffraction gratings are analyzed. First setup employs a conventional 4f optical system. In this one-to-one imaging system, collimated light is propagated through a lens, filtered with an aperture and then imaged onto a CCD by a second lens. Second system is more compact to improve image quality and to reduce noise. This is achieved by using an off-axis converging laser beam illumination that forms the Fourier plane near the imaging lens. This approach has important advantages such as reducing number of optical components and minimizing the optical path. The system was optimized considering parameters such as laser converging angle, laser beam size at MEMS chip, and magnification of the imaging system.