Researcher:
Akhtar, Muhammad Junaid

Profile Picture
ORCID

Job Title

Master Student

First Name

Muhammad Junaid

Last Name

Akhtar

Name

Name Variants

Akhtar, Muhammad Junaid

Email Address

Birth Date

Filters

2021 - 20232

Advanced Search

Filter by

Settings

Researcher Of Publications: search.filters.isAuthorOfPublication.f88b717c-06e3-4bf9-97ef-b5e6ca96ce4c

Search Results

Now showing 1 - 2 of 2
  • Placeholder
    PublicationMetadata only
    Photolithography-based microfabrication of biodegradable flexible and stretchable sensors
    (Wiley-V C H Verlag Gmbh, 2023) İstif, Emin; N/A; N/A; Department of Mechanical Engineering; N/A; N/A; Department of Mechanical Engineering; Bathaei, Mohammad Javad; Singh, Rahul; Mirzajani, Hadi; Akhtar, Muhammad Junaid; Abbasiasl, Taher; Beker, Levent; PhD Student; PhD Student; Researcher; Master Student; PhD Student; Faculty Member; Department of Mechanical Engineering; Graduate School of Sciences and Engineering; Graduate School of Sciences and Engineering; College of Engineering; Graduate School of Sciences and Engineering; Graduate School of Sciences and Engineering; College of Engineering; N/A; N/A; N/A; N/A; N/A; 308798
    Biodegradable sensors based on integrating conductive layers with polymeric materials in flexible and stretchable forms have been established. However, the lack of a generalized microfabrication method results in large-sized, low spatial density, and low device yield compared to the silicon-based devices manufactured via batch-compatible microfabrication processes. Here, a batch fabrication-compatible photolithography-based microfabrication approach for biodegradable and highly miniaturized essential sensor components is presented on flexible and stretchable substrates. Up to 1600 devices are fabricated within a 1 cm(2) footprint and then the functionality of various biodegradable passive electrical components, mechanical sensors, and chemical sensors is demonstrated on flexible and stretchable substrates. The results are highly repeatable and consistent, proving the proposed method's high device yield and high-density potential. This simple, innovative, and robust fabrication recipe allows complete freedom over the applicability of various biodegradable materials with different properties toward the unique application of interests. The process offers a route to utilize standard micro-fabrication procedures toward scalable fabrication of highly miniaturized flexible and stretchable transient sensors and electronics.
  • Thumbnail Image
    PublicationOpen Access
    Simulation of bulk piezoelectric implant with amplitude modulation-based backscatter communication for implant applications
    (Institute of Electrical and Electronics Engineers (IEEE), 2021) Akhtar M.J., Toymus A.T., Beker L.; Department of Mechanical Engineering; Department of Electrical and Electronics Engineering; Toymus, Alp Timuçin; Akhtar, Muhammad Junaid; Beker, Levent; Faculty Member; Department of Mechanical Engineering; Department of Electrical and Electronics Engineering; College of Engineering; Graduate School of Sciences and Engineering; N/A; N/A; 308798
    Recently, ultrasound has been used for power transfer and backward data transmission from implantable medical devices. Backward data communication is typically based on the amplitude modulation of the backscattered signal with changing electrical load of the implant. Contrary to its importance, the sensitivity of the backscattered voltage with reference to the electrical load has not been quantitatively determined yet. This work presents the results of transient simulations and shows the increasing trend in echo voltage with the increasing load resistance. Additionally, simulation studies indicate a decreasing sensitivity of echo voltage to load resistance with increasing backing impedance of the implant.