A grid of dielectric sensors to monitor mold filling and resin cure in resin transfer molding

Abstract

A grid of 50 dielectric sensors has been embedded in the walls of a mold to monitor resin transfer molding (RTM). The capacitance of each sensor increased as resin occupied the space between sensor plates, and it decreased with curing. Monitoring data can be used for process control to prevent dry spots and to determine when to de-mold the part. In previous studies, Skordos et al. [Skordos AA, Karkanas PI, Partridge IK. A dielectric sensor for measuring flow in resin transfer molding. Meas Sci Technol 2000; 11:25-31] used a lineal sensor, Hegg et al. [Hegg MC, Ogale A, Mescher A, Mamishev AV, Minaie B. Remote monitoring of resin transfer molding processes by distributed dielectric sensors. J Compos Mater 2005;39(17)] used three large sensors. As experimentally shown in this study, these lineal or large-plate dielectric sensors may mislead since a sensor measures total fraction of the sensor's plate area occupied by resin but not the resin's whereabouts. To avoid ambiguity and yet maintain detailed monitoring, a sensor grid was made at the projections of embedded orthogonal electrodes. The developed sensor operation system eliminated tedious and costly manufacturing of conventionally shielded separate sensors. The success of the developed sensor system was demonstrated in RTM experiments.