Deterministic assembly of channeling cracks as a tool for nanofabrication

Abstract

To address the necessity for a predictive computational tool for layout design in crack lithography, a tool for nanowire fabrication, a computational study is carried out using finite element analysis, where crack-free edge and crack-crack interactions are studied for various material combinations. While the first scenario addresses the ability to induce a controlled curvature in a nanowire, the latter provides an estimation of the minimum distance which can be kept between two straight nanowires. The computational study is accompanied by an experimental demonstration on Si/SiO(2) multilayers. Finite element results are found to be well aligned with experimental observations and theoretical predictions. Stronger interaction is evident with a curved crack front modeling as well as with increasing first and decreasing second Dundurs' parameters. Therefore cracks can be packed closer with decreasing film stiffness.