<link rel="stylesheet" href="styles.f3b1fba60ec7970c.css">

Publication:
Reconfigurable intelligent surfaces for 6G: emerging hardware architectures, applications, and open challenges

Loading...
Thumbnail Image

Departments

School / College / Institute

Item type:Organizational Unit,

Program

Organization Authors

Co-Authors

Alexandropoulos, George C.

Liu, Yuanwei

Wu, Qingqing

Jin, Shi

Yuen, Chau

Dobre, Octavia A.

Schober, Robert

Date

Language

Embargo Status

Journal Title

Journal ISSN

Volume Title

Alternative Title

Abstract

Reconfigurable intelligent surfaces (RISs) are rapidly gaining prominence in the realm of 5G-advanced and predominantly 6G mobile networks, offering a revolutionary approach to optimizing wireless communications. This article delves into the intricate world of the RIS technology, exploring its diverse hardware architectures and the resulting versatile operating modes. These include RISs with signal reception and processing units, sensors, amplification units, transmissive capability, multiple stacked components, and dynamic metasurface antennas (DMAs). Furthermore, we shed light on emerging RIS applications, such as index and reflection modulation, noncoherent modulation, next-generation multiple access (NGMA), integrated sensing and communications (ISAC), energy harvesting (EH), as well as aerial and vehicular networks. These exciting applications are set to transform the way we will wirelessly connect in the upcoming era of 6G. Finally, we review recent experimental RIS setups and present various open problems of the overviewed RIS hardware architectures and their applications. From enhancing network coverage to enabling new communication paradigms, RIS-empowered connectivity is poised to play a pivotal role in shaping the future of wireless networking. This article unveils the underlying principles and potential impacts of RISs, focusing on cutting-edge developments of this physical-layer smart connectivity technology.

Source

Publisher

IEEE-Institute of Electrical and Electronics Engineers

Citation

item.page.haspartof

Source

IEEE Vehicular Technology Magazine

item.page.ispartofseries

item.page.edition

DOI

10.1109/MVT.2024.3415570

item.page.datauri

item.page.link

Rights

Copyrights Note

Endorsement

Review

Supplemented By

Referenced By

Related Patent

Related Goal

Google Scholar
Scholar'da Ara ↗
6
Görüntülenme
20
İndirme
Altmetric
Dimensions
PlumX Metrikleri
BIP! Indicators