Publication:
Modeling miniaturized piezoelectric ultrasound transducers: comparison of lumped and finite element models

dc.contributor.departmentDepartment of Mechanical Engineering
dc.contributor.kuauthorKullukçu, Berkay
dc.contributor.kuauthorBeker, Levent
dc.contributor.kuprofilePhD Student
dc.contributor.kuprofileMaster Student
dc.contributor.kuprofileFaculty Member
dc.contributor.otherDepartment of Mechanical Engineering
dc.contributor.schoolcollegeinstituteCollege of Engineering
dc.contributor.yokidN/A
dc.contributor.yokidN/A
dc.contributor.yokid308798
dc.date.accessioned2024-11-09T23:06:13Z
dc.date.issued2020
dc.description.abstractIn the quest to develop wirelessly-powered implantable medical devices (IMD), ultrasonic power transfer has received significant attention due to its distinct advantages (sub-mm wavelength, lower attenuation, higher allowed power intensity by the FDA) compared to other alternatives such as radio frequency-based approaches. A typical power link structure for US-based IMDs consists of a piezoelectric cube (PC) and an easy to use modeling technique would provide value insights for design of such wireless power systems. Equivalent circuit modeling (ECM) is the most common method utilized to model piezoelectric acoustic devices. In this work, a detailed analysis of two commonly used ECM models, KLM and Leach are developed specifically for a PC resonator. Then, a 3D finite element model is developed and the results of the developed ECM are compared with the finite element model results for a PC as well as other aspect ratios of the transducer. The two ECM models yielded similar results with a difference of less than 0.5%. The Leach model does not utilize frequency-dependent elements, its implementation in conventional circuit analysis software is more straightforward. Through ECM, the effect of each design parameter on transducer characteristics could be determined. However, to achieve more accurate results as the aspect ratio converges to one, the use FEM or experimental data to perform modification on ECM is necessary.
dc.description.indexedbyWoS
dc.description.indexedbyScopus
dc.description.openaccessYES
dc.description.publisherscopeInternational
dc.description.sponsorshipDaxsonics Ultrasound
dc.description.sponsorshipet al.
dc.description.sponsorshipFujifilm VisualSonics, Inc
dc.description.sponsorshipPolytec
dc.description.sponsorshipus4us Ltd.
dc.description.sponsorshipVerasonics
dc.description.volume2020-September
dc.identifier.doi10.1109/IUS46767.2020.9251723
dc.identifier.isbn9781-7281-5448-0
dc.identifier.issn1948-5719
dc.identifier.linkhttps://www.scopus.com/inward/record.uri?eid=2-s2.0-85097887372&doi=10.1109%2fIUS46767.2020.9251723&partnerID=40&md5=48012af00a08db9234464eaecb91d27c
dc.identifier.scopus2-s2.0-85097887372
dc.identifier.urihttps://dx.doi.org/10.1109/IUS46767.2020.9251723
dc.identifier.urihttps://hdl.handle.net/20.500.14288/8942
dc.identifier.wos635688900416
dc.keywordsAcoustic resonators
dc.keywordsAspect ratio
dc.keywordsEnergy transfer
dc.keywordsEquivalent circuits
dc.keywordsLeaching
dc.keywordsLumped parameter networks
dc.keywordsMillimeter waves
dc.keywordsPiezoelectricity
dc.keywordsSubmillimeter waves
dc.keywordsTransducers
dc.keywordsUltrasonic applications
dc.keywordsUltrasonic transducers
dc.languageEnglish
dc.publisherIEEE
dc.sourceIEEE International Ultrasonics Symposium, IUS
dc.subjectElectrical electronics engineering
dc.titleModeling miniaturized piezoelectric ultrasound transducers: comparison of lumped and finite element models
dc.typeConference proceeding
dspace.entity.typePublication
local.contributor.authoridN/A
local.contributor.authorid0000-0002-0784-1537
local.contributor.authorid0000-0002-9777-6619
local.contributor.kuauthorKullukçu, Berkay
local.contributor.kuauthorBeker, Levent
relation.isOrgUnitOfPublicationba2836f3-206d-4724-918c-f598f0086a36
relation.isOrgUnitOfPublication.latestForDiscoveryba2836f3-206d-4724-918c-f598f0086a36

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