Publication:
Simulation of bulk piezoelectric implant with amplitude modulation-based backscatter communication for implant applications

dc.contributor.coauthorAkhtar M.J., Toymus A.T., Beker L.
dc.contributor.departmentDepartment of Mechanical Engineering
dc.contributor.departmentDepartment of Electrical and Electronics Engineering
dc.contributor.kuauthorToymus, Alp Timuçin
dc.contributor.kuauthorAkhtar, Muhammad Junaid
dc.contributor.kuauthorBeker, Levent
dc.contributor.kuprofileFaculty Member
dc.contributor.otherDepartment of Mechanical Engineering
dc.contributor.otherDepartment of Electrical and Electronics Engineering
dc.contributor.schoolcollegeinstituteCollege of Engineering
dc.contributor.schoolcollegeinstituteGraduate School of Sciences and Engineering
dc.contributor.yokidN/A
dc.contributor.yokidN/A
dc.contributor.yokid308798
dc.date.accessioned2024-11-09T12:01:32Z
dc.date.issued2021
dc.description.abstractRecently, ultrasound has been used for power transfer and backward data transmission from implantable medical devices. Backward data communication is typically based on the amplitude modulation of the backscattered signal with changing electrical load of the implant. Contrary to its importance, the sensitivity of the backscattered voltage with reference to the electrical load has not been quantitatively determined yet. This work presents the results of transient simulations and shows the increasing trend in echo voltage with the increasing load resistance. Additionally, simulation studies indicate a decreasing sensitivity of echo voltage to load resistance with increasing backing impedance of the implant.
dc.description.fulltextYES
dc.description.indexedbyWoS
dc.description.indexedbyScopus
dc.description.openaccessYES
dc.description.publisherscopeInternational
dc.description.sponsoredbyTubitakEuN/A
dc.description.sponsorshipN/A
dc.description.versionAuthor's final manuscript
dc.formatpdf
dc.identifier.doi10.1109/IUS52206.2021.9593728
dc.identifier.embargoNO
dc.identifier.filenameinventorynoIR03482
dc.identifier.issn1948-5719
dc.identifier.linkhttps://doi.org/10.1109/IUS52206.2021.9593728
dc.identifier.quartileN/A
dc.identifier.scopus2-s2.0-85122898320
dc.identifier.urihttps://hdl.handle.net/20.500.14288/968
dc.identifier.wos832095000386
dc.keywordsAcoustics
dc.keywordsBackscatter
dc.keywordsCircuit model
dc.keywordsEcho modulation
dc.keywordsImplants
dc.keywordsPiezoelectric
dc.keywordsUltrasound
dc.languageEnglish
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)
dc.relation.grantnoNA
dc.relation.urihttp://cdm21054.contentdm.oclc.org/cdm/ref/collection/IR/id/10274
dc.sourceIEEE International Ultrasonics Symposium, IUS
dc.subjectInductive power transmission
dc.subjectUltrasonics
dc.subjectEnergy transfer
dc.titleSimulation of bulk piezoelectric implant with amplitude modulation-based backscatter communication for implant applications
dc.typeConference proceeding
dspace.entity.typePublication
local.contributor.authoridN/A
local.contributor.authoridN/A
local.contributor.authorid0000-0002-9777-6619
local.contributor.kuauthorToymus, Alp Timuçin
local.contributor.kuauthorAkhtar, Muhammad Junaid
local.contributor.kuauthorBeker, Levent
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relation.isOrgUnitOfPublication21598063-a7c5-420d-91ba-0cc9b2db0ea0
relation.isOrgUnitOfPublication.latestForDiscovery21598063-a7c5-420d-91ba-0cc9b2db0ea0

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