(Institute of Electrical and Electronics Engineers (IEEE), 2008) Yilmaz, Mehmet; Yalcinkaya, Arda D.; Leblebici, Yusuf; Zervas, Michalis; Department of Mechanical Engineering; Alaca, Burhanettin Erdem; Faculty Member; Department of Mechanical Engineering; Koç University Surface Science and Technology Center (KUYTAM) / Koç Üniversitesi Yüzey Teknolojileri Araştirmalari Merkezi (KUYTAM); College of Engineering; 115108
A multi-digit gripper is proposed that consists of two electrostatically actuated end-effectors operating in the plane of the device and three thermal end-effectors operating out of plane. The integration of thermal and electrostatic actuation mechanisms is realized by using a three-mask monolithic process. First mask is used to define the silicon electrostatic actuator on SOI wafer. Second mask is used to obtain the bimorph thermal microactuator made of polyimide and aluminum layers on top of the electrostatic actuator. Third and the final mask is used to release the integrated electrostatic and thermal microactuators.
