Publication: Thermal deflections in multilayer microstructures and athermalization
Files
Program
KU-Authors
KU Authors
Co-Authors
Publication Date
Language
Type
Embargo Status
NO
Journal Title
Journal ISSN
Volume Title
Alternative Title
Abstract
Exact and approximate analytical solutions are developed for calculating the thermally induced deformation of three-layer cantilever structures. The solution is derived from the closed-form solutions for multilayer films. Thermal deformation and athermalization conditions are derived using dimensionless parameters for film to substrate thickness ratios for three-layer structures. The analytical solution for a narrow beam is applied to a scan mirror plate suspended with two torsional flexures. The results agreed well with finite element method simulations and experiments. Tests are performed using a bulk-micromachined silicon microelectromechanical system scanner that has a thin gold (Au) coil layer on one side and an aluminum (Al) mirror layer on the other side. Useful figures using film-to-substrate thickness ratios and the material independent normalized parameters are introduced for easy thermal deformation computations and performance trades for three-layer structures.
Source
Publisher
American Institute of Physics (AIP) Publishing
Subject
Physics
Citation
Has Part
Source
Journal of Applied Physics
Book Series Title
Edition
DOI
10.1063/1.2216789