Publication:
Thermal deflections in multilayer microstructures and athermalization

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dc.contributor.departmentDepartment of Electrical and Electronics Engineering
dc.contributor.departmentDepartment of Electrical and Electronics Engineering
dc.contributor.kuauthorTorun, Hamdi
dc.contributor.kuauthorÜrey, Hakan
dc.contributor.kuprofileFaculty Member
dc.contributor.schoolcollegeinstituteCollege of Engineering
dc.contributor.yokidN/A
dc.contributor.yokid8579
dc.date.accessioned2024-11-09T13:11:20Z
dc.date.issued2006
dc.description.abstractExact and approximate analytical solutions are developed for calculating the thermally induced deformation of three-layer cantilever structures. The solution is derived from the closed-form solutions for multilayer films. Thermal deformation and athermalization conditions are derived using dimensionless parameters for film to substrate thickness ratios for three-layer structures. The analytical solution for a narrow beam is applied to a scan mirror plate suspended with two torsional flexures. The results agreed well with finite element method simulations and experiments. Tests are performed using a bulk-micromachined silicon microelectromechanical system scanner that has a thin gold (Au) coil layer on one side and an aluminum (Al) mirror layer on the other side. Useful figures using film-to-substrate thickness ratios and the material independent normalized parameters are introduced for easy thermal deformation computations and performance trades for three-layer structures.
dc.description.fulltextYES
dc.description.indexedbyWoS
dc.description.indexedbyScopus
dc.description.issue2
dc.description.openaccessYES
dc.description.publisherscopeInternational
dc.description.sponsoredbyTubitakEuN/A
dc.description.sponsorshipN/A
dc.description.versionPublisher version
dc.description.volume100
dc.formatpdf
dc.identifier.doi10.1063/1.2216789
dc.identifier.eissn1089-7550
dc.identifier.embargoNO
dc.identifier.filenameinventorynoIR00952
dc.identifier.issn0021-8979
dc.identifier.linkhttps://doi.org/10.1063/1.2216789
dc.identifier.quartileQ2
dc.identifier.scopus2-s2.0-33746833147
dc.identifier.urihttps://hdl.handle.net/20.500.14288/2855
dc.identifier.wos239423400052
dc.languageEnglish
dc.publisherAmerican Institute of Physics (AIP) Publishing
dc.relation.urihttp://cdm21054.contentdm.oclc.org/cdm/ref/collection/IR/id/955
dc.sourceJournal of Applied Physics
dc.subjectPhysics
dc.titleThermal deflections in multilayer microstructures and athermalization
dc.typeJournal Article
dspace.entity.typePublication
local.contributor.authoridN/A
local.contributor.authorid0000-0002-2031-7967
local.contributor.kuauthorTorun, Hamdi
local.contributor.kuauthorÜrey, Hakan
relation.isOrgUnitOfPublication21598063-a7c5-420d-91ba-0cc9b2db0ea0
relation.isOrgUnitOfPublication.latestForDiscovery21598063-a7c5-420d-91ba-0cc9b2db0ea0

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