Publication:
On heat transfer at microscale with implications for microactuator design

Placeholder

School / College / Institute

Organizational Unit

Program

KU Authors

Co-Authors

Yalçınkaya, Arda D.
Zervas, Michalis
Leblebici, Yusuf

Publication Date

Language

Embargo Status

Journal Title

Journal ISSN

Volume Title

Alternative Title

Abstract

The dominance of conduction and the negligible effect of gravity, and hence free convection, are verified in the case of microscale heat sources surrounded by air at atmospheric pressure. A list of temperature-dependent heat transfer coefficients is provided. In contrast to previous approaches based on free convection, supplied coefficients converge with increasing temperature. Instead of creating a new external function for the definition of boundary conditions via conductive heat transfer, convective thin film coefficients already embedded in commercial finite element software are utilized under a constant heat flux condition. This facilitates direct implementation of coefficients, i. e. the list supplied in this work can directly be plugged into commercial software. Finally, the following four-step methodology is proposed for modeling: (i) determination of the thermal time constant of a specific microactuator, (ii) determination of the boundary layer size corresponding to this time constant, (iii) extraction of the appropriate heat transfer coefficients from a list provided and (iv) application of these coefficients as boundary conditions in thermomechanical finite element simulations. An experimental procedure is established for the determination of the thermal time constant, the first step of the proposed methodology. Based on conduction, the proposed method provides a physically sound solution to heat transfer issues encountered in the modeling of thermal microactuators.

Source

Publisher

Iop Publishing Ltd

Subject

Engineering, Electrical and electronics engineering, Nanoscience, Nanotechnology, Instruments, Instrumentation, Physics, Applied physics

Citation

Has Part

Source

Journal of Micromechanics and Microengineering

Book Series Title

Edition

DOI

10.1088/0960-1317/19/4/045020

item.page.datauri

Link

Rights

Copyrights Note

Endorsement

Review

Supplemented By

Referenced By

0

Views

0

Downloads

View PlumX Details