Constraints on monitoring resin flow in the resin transfer molding (RTM) process by using thermocouple sensors

Abstract

In this study, a thermocouple sensor system was used to monitor the resin transfer molding (RTM) process. These sensors are low-cost and durable; and they do not disturb the resin flow. They can be used if the inlet resin is either hotter or colder than the mold walls. In experiments of this study, much of the hot resin’s internal energy was transferred to cold mold walls by conduction, when the mold parts were made of a material with high thermal conductivity, such as aluminum. A mathematical model based on 1D flow and 2D unsteady energy conservation was developed to investigate the heat transfer between resin and mold walls. The numerical solution of this model is in qualitative agreement with the results of our experiments. The thermocouple sensor system developed is more useful with the following process parameters: low thermal conductivity of mold material, high resin flow rate, high temperature difference between inlet resin and initial mold walls, and high specific heat of resin. However, for the typical use of RTM materials and typical injection parameters, thermocouples should not be preferred over other sensor types and should be used with caution due to the shortcomings investigated in this study.