Publication:
MOEMS thermal imaging camera

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dc.contributor.coauthorTorun, Hamdi
dc.contributor.coauthorDegertekin, F. Levent
dc.contributor.departmentN/A
dc.contributor.departmentN/A
dc.contributor.departmentDepartment of Electrical and Electronics Engineering
dc.contributor.kuauthorToy, Muhammed Fatih
dc.contributor.kuauthorFerhanoğlu, Onur
dc.contributor.kuauthorÜrey, Hakan
dc.contributor.kuprofilePhD Student
dc.contributor.kuprofileFaculty Member
dc.contributor.otherDepartment of Electrical and Electronics Engineering
dc.contributor.schoolcollegeinstituteGraduate School of Sciences and Engineering
dc.contributor.schoolcollegeinstituteGraduate School of Sciences and Engineering
dc.contributor.schoolcollegeinstituteCollage of Engineering
dc.contributor.yokidN/A
dc.contributor.yokid205198
dc.contributor.yokid8579
dc.date.accessioned2024-11-09T23:42:57Z
dc.date.issued2008
dc.description.abstractA novel thermo-mechanical Infrared (IR) imaging array with integrated diffraction gratings for optical readout was fabricated and tested. Parylene was used as a structural material for its low thermal conductivity and high thermal expansion properties. Tests were performed using an IR blackbody target and first order diffracted light was imaged on a CCD camera to monitor the entire array. Results show that it is possible to achieve <100mK NETD using a 12 bit CCD camera.
dc.description.indexedbyWoS
dc.description.indexedbyScopus
dc.description.openaccessNO
dc.description.sponsorshipASELSAN (Turkey)
dc.description.sponsorshipNSF [0423403] This work is partly sponsored by ASELSAN (Turkey). Wed like to acknowledge the support from NSF International collaboration grant (award number: 0423403) and the MiRC staff at Georgia Tech.
dc.identifier.doi10.1109/RME.2008.4595735
dc.identifier.isbn978-1-4244-1983-8
dc.identifier.scopus2-s2.0-51849121067
dc.identifier.urihttp://dx.doi.org/10.1109/RME.2008.4595735
dc.identifier.urihttps://hdl.handle.net/20.500.14288/13410
dc.identifier.wos259117000026
dc.keywordsComputer science, hardware and architecture
dc.keywordsEngineering, electrical and electronic
dc.keywordsTelecommunications
dc.languageEnglish
dc.publisherIeee
dc.sourcePrime: 2008 Phd Research In Microelectronics And Electronics, Proceedings
dc.subjectComputer science
dc.subjectComputer architecture
dc.subjectCivil engineering
dc.subjectElectrical electronics engineering
dc.subjectTelecommunication
dc.titleMOEMS thermal imaging camera
dc.typeConference proceeding
dspace.entity.typePublication
local.contributor.authorid0000-0003-0176-8807
local.contributor.authorid0000-0002-5381-533X
local.contributor.authorid0000-0002-2031-7967
local.contributor.kuauthorToy, Muhammed Fatih
local.contributor.kuauthorFerhanoğlu, Onur
local.contributor.kuauthorÜrey, Hakan
relation.isOrgUnitOfPublication21598063-a7c5-420d-91ba-0cc9b2db0ea0
relation.isOrgUnitOfPublication.latestForDiscovery21598063-a7c5-420d-91ba-0cc9b2db0ea0

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