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MOEMS thermal imaging camera

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dc.conference.dateJUN 22-25, 2008
dc.conference.locationIstanbul, Turkey
dc.conference.organizerConference on PhD Research in Microelectronics and Electronics
dc.contributor.coauthorTorun, Hamdi
dc.contributor.coauthorDegertekin, F. Levent
dc.contributor.departmentDepartment of Electrical and Electronics Engineering
dc.contributor.departmentGraduate School of Sciences and Engineering
dc.contributor.facultymemberYes
dc.contributor.kuauthorFerhanoğlu, Onur
dc.contributor.kuauthorToy, Muhammed Fatih
dc.contributor.kuauthorÜrey, Hakan
dc.contributor.schoolcollegeinstituteCollege of Engineering
dc.contributor.schoolcollegeinstituteGRADUATE SCHOOL OF SCIENCES AND ENGINEERING
dc.date.accessioned2024-11-09T23:42:57Z
dc.date.issued2008
dc.description.abstractA novel thermo-mechanical Infrared (IR) imaging array with integrated diffraction gratings for optical readout was fabricated and tested. Parylene was used as a structural material for its low thermal conductivity and high thermal expansion properties. Tests were performed using an IR blackbody target and first order diffracted light was imaged on a CCD camera to monitor the entire array. Results show that it is possible to achieve <100mK NETD using a 12 bit CCD camera.
dc.description.fulltextNo
dc.description.harvestedfromManual
dc.description.indexedbyWOS
dc.description.indexedbyScopus
dc.description.openaccessNO
dc.description.peerreviewstatusN/A
dc.description.publisherscopeInternational
dc.description.readpublishN/A
dc.description.sponsoredbyTubitakEuN/A
dc.description.sponsorshipASELSAN
dc.description.sponsorshipNSF [0423403] This work is partly sponsored by ASELSAN (Turkey). Wed like to acknowledge the support from NSF International collaboration grant (award number: 0423403) and the MiRC staff at Georgia Tech.
dc.description.studentonlypublicationNo
dc.description.studentpublicationYes
dc.description.versionN/A
dc.identifier.WoSQuartileN/A
dc.identifier.doi10.1109/RME.2008.4595735
dc.identifier.embargoN/A
dc.identifier.endpage104
dc.identifier.grantnoNational Science Foundation [0423403]
dc.identifier.isbn9781424419838
dc.identifier.scopus2-s2.0-51849121067
dc.identifier.startpage101
dc.identifier.urihttps://doi.org/10.1109/RME.2008.4595735
dc.identifier.urihttps://hdl.handle.net/20.500.14288/13410
dc.identifier.wos000259117000026
dc.keywordsBuilding materials
dc.keywordsCCD cameras
dc.keywordsCharge coupled devices
dc.keywordsDigital cameras
dc.keywordsElectronics industry
dc.keywordsMicroelectronics
dc.keywordsOptical design
dc.keywordsThermal spraying
dc.keywordsThermoelectricity
dc.language.isoeng
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)
dc.relation.affiliationKoç University
dc.relation.collectionKoç University Institutional Repository
dc.relation.ispartofPrime: 2008 PhD Research In Microelectronics And Electronics, Proceedings
dc.relation.openaccessN/A
dc.rightsN/A
dc.subjectComputer science
dc.subjectComputer architecture
dc.subjectCivil engineering
dc.subjectElectrical electronics engineering
dc.subjectTelecommunication
dc.titleMOEMS thermal imaging camera
dc.typeConference Proceeding
dspace.entity.typePublication
local.contributor.kuauthorToy, Muhammed Fatih
local.contributor.kuauthorFerhanoğlu, Onur
local.contributor.kuauthorÜrey, Hakan
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