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A stochastic integral equation method for modeling the rough surface effect on interconnect capacitance

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dc.contributor.coauthorZhu, Zhenhai
dc.contributor.coauthorWhite, Jacob
dc.contributor.departmentDepartment of Electrical and Electronics Engineering
dc.contributor.kuauthorDemir, Alper
dc.contributor.schoolcollegeinstituteCollege of Engineering
dc.date.accessioned2024-11-09T23:50:09Z
dc.date.issued2004
dc.description.abstractIn this paper we describe a stochastic integral equation method for computing the mean value and the variance of capacitance of interconnects with random surface roughness. An ensemble average Green's function is combined with a matrix Neumann expansion to compute nominal capacitance and its variance. This method avoids the time-consuming Monte Carlo simulations and the discretization of rough surfaces. Numerical experiments show that the results of the new method agree very well with Monte Carlo simulation results. © 2004 IEEE.
dc.description.indexedbyScopus
dc.description.indexedbyWOS
dc.description.openaccessYES
dc.description.publisherscopeInternational
dc.description.sponsoredbyTubitakEuN/A
dc.description.sponsorshipIEEE
dc.description.sponsorshipIEEE CASS/CANDE
dc.description.sponsorshipIEEE Computer Society
dc.description.sponsorshipACM SIGDA
dc.description.sponsorshipIEEE Electron Devices Society, EDS
dc.identifier.doi10.1109/ICCAD.2004.1382699
dc.identifier.isbn0780-3870-23
dc.identifier.issn1092-3152
dc.identifier.quartileN/A
dc.identifier.scopus2-s2.0-16244375540
dc.identifier.urihttps://doi.org/10.1109/ICCAD.2004.1382699
dc.identifier.urihttps://hdl.handle.net/20.500.14288/14484
dc.keywordsGaussian distribution
dc.keywordsRough surface
dc.keywordsSpatial correlation
dc.keywordsStandard deviation
dc.keywordsComputer simulation
dc.keywordsCorrelation methods
dc.keywordsFunctions
dc.keywordsInterconnection networks
dc.keywordsMathematical models
dc.keywordsMonte Carlo methods
dc.keywordsRandom processes
dc.keywordsStatistical methods
dc.keywordsSurface roughness
dc.keywordsCapacitance
dc.language.isoeng
dc.publisherIEEE-Inst Electrical Electronics Engineers Inc
dc.relation.ispartofIEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD
dc.subjectElectrical and electronics engineering
dc.titleA stochastic integral equation method for modeling the rough surface effect on interconnect capacitance
dc.typeConference Proceeding
dspace.entity.typePublication
local.contributor.kuauthorDemir, Alper
local.publication.orgunit1College of Engineering
local.publication.orgunit2Department of Electrical and Electronics Engineering
relation.isOrgUnitOfPublication21598063-a7c5-420d-91ba-0cc9b2db0ea0
relation.isOrgUnitOfPublication.latestForDiscovery21598063-a7c5-420d-91ba-0cc9b2db0ea0
relation.isParentOrgUnitOfPublication8e756b23-2d4a-4ce8-b1b3-62c794a8c164
relation.isParentOrgUnitOfPublication.latestForDiscovery8e756b23-2d4a-4ce8-b1b3-62c794a8c164

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