Researcher:
Yalçınkaya, Arda Deniz

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Arda Deniz

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Yalçınkaya

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Yalçınkaya, Arda Deniz

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Now showing 1 - 9 of 9
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    Publication
    Batch fabrication of self-assembled nickel-iron nanowires by electrodeposition
    (IEEE, 2006) N/A; Department of Electrical and Electronics Engineering; Department of Mechanical Engineering; Şardan, Özlem; Yalçınkaya, Arda Deniz; Alaca, Burhanettin Erdem; Master Student; Researcher; Faculty Member; Department of Electrical and Electronics Engineering; Department of Mechanical Engineering; Graduate School of Sciences and Engineering; College of Engineering; College of Engineering; N/A; 144523; 115108
    Lack of batch-compatible fabrication techniques can be considered as the most important challenge in the integration of nanostructures with microelectromechanical systems (MEMS). a solution to the micro-nano integration problem is offered by introducing a batch-compatible nanowire fabrication technique based on basic lithographic techniques and guided self-assembly. the basic principle is obtaining cracks at predetermined locations in a sacrificial SiO2 layer on Si and filling these cracks with a suitable metal by electrodeposition. the technique is demonstrated by using Nickel-Iron as the deposition material and verifying the magnetic behavior of resulting nanowires.
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    Modeling and characterization of soft magnetic film actuated 2-D scanners
    (Ieee-Inst Electrical Electronics Engineers Inc, 2007) N/A; N/A; N/A; Department of Electrical and Electronics Engineering; Department of Electrical and Electronics Engineering; Işıkman, Serhan Ömer; Ergeneman, Olgaç; Yalçınkaya, Arda Deniz; Ürey, Hakan; Master Student; Master Student; Researcher; Faculty Member; Department of Electrical and Electronics Engineering; Graduate School of Sciences and Engineering; Graduate School of Sciences and Engineering; College of Engineering; College of Engineering; N/A; N/A; 144523; 8579
    Magnetic behavior of polymer-based scanners is studied in detail with emphasis on a new magnetic actuator model and dc deflection experiments. A 30-mu m-thick permalloy sheet is plated on a polymer cantilever scanner and actuated using an external coil. Mechanical and magnetic modeling of the device and experimental results are presented. Shape anisotropy of the thin, soft magnetic film is explored for push and pull operation in different configurations. A new magnetic actuator model is developed based on the distributed point-by-point calculation of the magnetostatic moments and forces across the film surface. This effort helps one to obtain generic equations for magnetic force and torque without limiting the use of the model to the case where magnetic material is assumed to be fully saturated. Two-dimensional (2-D) scanning utilizing the orthogonal modes of the scanner, using only one actuation coil is presented.
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    Microgrippers: a case study for batch-compatible integration of MEMS with nanostructures
    (Iop Publishing Ltd, 2007) Sardan, O.; Boggild, P.; Tang, P. T.; Hansen, O.; Department of Mechanical Engineering; Department of Electrical and Electronics Engineering; Alaca, Burhanettin Erdem; Yalçınkaya, Arda Deniz; Faculty Member; Researcher; Department of Mechanical Engineering; Department of Electrical and Electronics Engineering; Koç University Surface Science and Technology Center (KUYTAM) / Koç Üniversitesi Yüzey Teknolojileri Araştırmaları Merkezi (KUYTAM); College of Engineering; College of Engineering; 115108; 144523
    A batch- compatible integration of micro- electro- mechanical systems ( MEMS) with nanoscale objects is demonstrated using the example of a gripping device with nanoscale end- effectors. The proposed nanofabrication technique is based on creating a certain number of nanowires/ ribbons on a planar surface, each with a known orientation, using self- assembled crack networks as a template. Since both the location and orientation of the nanowires/ ribbons are known, the gripping device can be lithographically transferred on to the substrate ensuring full integration of MEMS with nanoscale end- effectors. Two nanowires/ ribbons are attached to each MEMS solely at desired locations with a desired inclination in contrast to most other self- assembly- based techniques of growing nanoscale objects. Challenges unique to MEMS fabrication are encountered raising process requirements beyond those of the simple electrode - nanowire integration. With issues related to yield and end- effector geometry remaining to be studied further, the method proposes a true batch fabrication for nanoscale objects and their integration with MEMS, which does not require the use of nano- lithographic techniques.
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    Two-axis electromagnetic microscanner for high resolution displays
    (IEEE-Inst Electrical Electronics Engineers Inc, 2006) Brown, Dean; Montague, Tom; Sprague, Randy; Department of Electrical and Electronics Engineering; Department of Electrical and Electronics Engineering; Yalçınkaya, Arda Deniz; Ürey, Hakan; Researcher; Faculty Member; Department of Electrical and Electronics Engineering; College of Engineering; College of Engineering; 144523; 8579
    A novel microelectromechanical systems (MEMS) actuation technique is developed for retinal scanning display and imaging applications allowing effective drive of a two-axes scanning mirror to wide angles at high frequency. Modeling of the device in mechanical and electrical domains, as well as the experimental characterization is described. Full optical scan angles of 65 degrees and 53 degrees are achieved for slow (60 Hz; sawtooth) and fast (21.3 kHz sinusoid) scan directions, respectively. In combination with a mirror size of 1.5 mm, a resulting theta D-opt product of 79.5 deg(.)mm for fast axis is obtained. This two-dimensional (2-D) magnetic actuation technique delivers sufficient torque to allow non-resonant operation as low as dc in the slow-scan axis while at the same time allowing one-atmosphere operation even at fast-scan axis frequencies large enough to support SXGA (1280 x 1024) resolution scanned beam displays.
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    Self-assembly-based batch fabrication of nickel-iron nanowires by electroplating
    (IOP Publishing Ltd, 2006) N/A; Department of Electrical and Electronics Engineering; Department of Mechanical Engineering; Şardan, Özlem; Yalçınkaya, Arda Deniz; Alaca, Burhanettin Erdem; Master Student; Researcher; Faculty Member; Department of Electrical and Electronics Engineering; Department of Mechanical Engineering; Graduate School of Sciences and Engineering; College of Engineering; College of Engineering; N/A; 144523; 115108
    The reason behind the majority of difficulties encountered in the integration of nanoscale objects with microelectromechanical systems can almost always be traced back to the lack of batch-compatible fabrication techniques at the nanoscale. On the one hand, self-assembly products do not allow a high level of control on their orientation and numbers, and hence, their attachment to a micro device is problematic. On the other hand, top-down approaches, such as e-beam lithography, are far from satisfying the needs of mass fabrication due to their expensive and serial working principle. To overcome the difficulties in micro-nano integration, a batch-compatible nanowire fabrication technique is presented, which is based on fabricating nanowires using simple lithographic techniques and relying on guided self-assembly. The technique is based on creating cracks with a predetermined number and orientation in a thin SiO2 coating on Si substrate, and then filling the cracks with an appropriate material of choice. After the SiO2 coating is removed, nanowires remain on the Si surface as a replica of the crack network. The technique, previously confined to electroless deposition, is now extended to include electroplating, enabling the fabrication of nanowires of various alloys. As an example, arrays of NiFe nanowires are introduced and their magnetic behaviour is verified.
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    Publication
    Route to batch-compatible fabrication of nanotweezers by guided self-assembly
    (IEEE, 2007) Bøggild, Peter; Tang, P. Torben; Hansen, Ole; N/A; Department of Mechanical Engineering; Department of Electrical and Electronics Engineering; Şardan, Özlem; Alaca, Burhanettin Erdem; Yalçınkaya, Arda Deniz; Master Student; Faculty Member; Researcher; Department of Mechanical Engineering; Department of Electrical and Electronics Engineering; Graduate School of Sciences and Engineering; College of Engineering; College of Engineering; N/A; 115108; 144523
    Fabrication of integrated micro and nanoscale components in a single batch is one of the biggest challenges for nanosystems developement. A self-assembly technique that enables "batch-compatible" integration of micro electro mechanical systems with nanoribbons is presented by demonstrating electrostatically actuated combdrive microgrippers with nanoribbon end-effectors. Preliminary fabrication results demonstrate the possibility of obtaining well defined spatial density and orientation of nanoribbons matching the precision of top-down techniques and at the same time allowing complete alignment and registry with subsequent lithography steps.
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    FR-4 as a new MOEMS platform
    (Ieee, 2007) N/A; Department of Electrical and Electronics Engineering; Department of Electrical and Electronics Engineering; N/A; N/A; Department of Electrical and Electronics Engineering; Holmstrom, Sven; Yalçınkaya, Arda Deniz; Işıkman, Serhan Ömer; Ataman, Çağlar; Ürey, Hakan; Researcher; Researcher; Master Student; PhD Student; Faculty Member; Department of Electrical and Electronics Engineering; College of Engineering; College of Engineering; Graduate School of Sciences and Engineering; Graduate School of Sciences and Engineering; College of Engineering; N/A; 144523; N/A; N/A; 8579
    FR4 is a well-engineered material and widely used in the PCB industry and lend itself to high degree of integration of optoelectronic, micro-optic, and electronic devices. FR4 is used for the first time as an actuated mechanical device that integrates several functions on the same device. Two different approaches to 2D laser scanning using a single electromagnetic actuation coil and application to Fourier Transform spectroscopy are presented; many other applications can be envisioned.
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    Two-axis MENIS scanner for display and imaging applications
    (IEEE-Inst Electrical Electronics Engineers Inc, 2005) Department of Electrical and Electronics Engineering; Department of Electrical and Electronics Engineering; Department of Electrical and Electronics Engineering; N/A; N/A; N/A; Department of Mechanical Engineering; Ürey, Hakan; Yalçınkaya, Arda Deniz; Brown, Dean; Anaç, Ozan; Ataman, Çağlar; Başdoğan, İpek; Faculty Member; Researcher; Researcher; N/A; N/A; Master Student; PhD Student; Faculty Member; Department of Electrical and Electronics Engineering; Department of Mechanical Engineering; College of Engineering; College of Engineering; College of Engineering; N/A; N/A; Graduate School of Sciences and Engineering; Graduate School of Sciences and Engineering; College of Engineering; 8579; 144523; N/A; N/A; N/A; N/A; N/A; 179940
    Two-axis gimbaled scanner used in an SVGa display product with 58deg optical scan angle, 1.5mm mirror size, and 21.KHz resonant frequency is reported Scanner is actuated electromagnetically using a single coil on the outer frame and by mechanical coupling of outer frame motion into the inner mirrorframe.
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    First experimental results on CMOS integrated nickel electroplated resonators
    (Institute of Physics (IOP) Publishing, 2004) Hansen, Ole; Department of Electrical and Electronics Engineering; Yalçınkaya, Arda Deniz; Researcher; Department of Electrical and Electronics Engineering; College of Engineering; 144523
    This paper presents experimental results on MEMS metallic add-on post-fabrication effects on complementary metal oxide semiconductor (CMOS) transistors. Two versions of add-on processing, that use either e-beam evaporation or magnetron sputtering, are compared through investigation of the electrical parameters of n-channel and p-channel transistors. The magnetron sputtering technique is shown to be compatible with standard CMOS electronics without any restriction of the metal types and annealing requirements.